Exemption Requests

The objective of this review is to provide a clear technical and scientific assessment for the below exemptions of Annex II to Directive 2000/53/EC (ELV Directive) which have become due for review.

Stakeholder consultation for the 12th Adaptation to scientific and technical progress of exemptions 2(c)(ii), 3, 8(e) and 8(g)(ii) of Annex II is open from 8th February 2024 to 18th April 2024.

No. Exemption wording Consultation Questionnaire Consultation Responses
2(c)(ii) Aluminium alloys not included in entry 2(c)(i) with a lead content up to 0.4 % by weight Download
3 Copper alloys containing up to 4 % of lead by weight Download
8(e) Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) Download
8(g)(ii) Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following:
  1. a semiconductor technology node of 90 nm or larger;
  2. a single die of 300 mm2 or larger in any semiconductor technology node;
  3. stacked die packages with dies of 300 mm2 or larger, or silicon interposers of 300mm2 or larger.